Contact research

by:CBFI     2020-10-06
Contact interface slightly protuberant arbitrary distribution under the condition of thermal contact resistance are studied, contact material design, superconducting materials and metal metal and metal. l Zhao etc with steady state method to study the contact interface between the filler, and the contact between the interface into the Kapton packing, at the end of the polymer film containing aluminum powder cases such as contact interface thermal resistance.

the transient method is also a kind of chaoyang contact interface thermal resistance experiment method, and a transient contact interface thermal resistance experiment method Method of field, transient method of field refers to the use of light and heat of transformation, as well as the production and the heat wave in the process of contact with the spread of solid materials, especially the thermal wave in the interface of the potter ( Phase, amplitude) Change, to get the material thermal physical properties, and the method of contact interface thermal resistance.

a lot of factors influencing the thermal resistance of the contact interface, including the material thermal physical properties, surface properties, surface roughness, load, temperature, and the interface of the medium and so on, therefore, the interface thermal resistance study design range is wide, the interface thermal resistance wit is quite complicated. Even if the same two objects interface thermal resistance, different test methods and the connection method will produce different results. On some occasions, such as large scale integrated circuit cooling, superconducting devices direct cooling machine to reduce the interface thermal resistance, and in some high insulation equipment, has the opposite requirements. In fact, for the same connection, in different operating conditions, requirements for the size of the interface thermal resistance is different also. For example, in order to reduce work CICC ac loss under the alternating magnetic field, it is best to increase the interface thermal resistance, and for the same connection way, under different operating conditions, requirements for the size of the interface thermal resistance is different also.
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